` E-Scan 655 MicroCurrent HVLD
  2. Container Closure Integrity Testing
  3. E-Scan 655 MicroCurrent HVLD
E-Scan 655 MicroCurrent HVLDAlpha Controls & Instrumentation Inc.

PTI Packaging Technologies and Inspection

E-Scan 655 MicroCurrent HVLD

A revolutionary deterministic offline micro leak test instrument

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The E-Scan 655 technology is a MicroCurrent conductivity test method, HVLDmc , that is completely non-destructive to the container and product; exposing the package and product to lower voltage than other conductivity based solutions. The technology uses a non-contact and non-invasive test method that requires no sample preparation. E-Scan 655 can be used with a wide range of liquid based products including low conductivity sterile water for injection (WFI) and proteinaceous products with suspensions. The E-Scan 655 features a fast test cycle and simple operation.  Additional benefits include quick changeover and easy recipe setup to accommodate a wide range of products and applications. The offline E-Scan 655 method can be migrated from laboratory to 100% inline testing applications at high production speeds.

The E-Scan testing process uses a set of electrode probes to scan a non-conductive container that is sealed. The container material can be glass, plastic, or poly laminate. The container or package must contain liquid (minimum fill 30%). If a pinhole, crack, or other defect is present, there is a resistance differential and change in current flow indicating a breach in the container. The approximate defect location can be identified.

 • Non-destructive, non-invasive, no sample preparation

• High level of repeatability and accuracy
• Effective across all parenteral products, including extremely low conductivity liquids (WFI)
• Lower voltage exposure produces no ozone, eliminating risk to the product and environment
• Listed in USP Chapter <1207> as recommended method for parenteral liquid package inspection
• Robust method and approximate 3x Signal-Noise-Ratio for a wide range of product classes and
 package formats
• Simplifies the inspection and validation process

 



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